特性 property |
单位 Unit |
条件 Condition |
标准 Standard |
ACYS131500 | ACYS252500 |
测试方法 Test method |
|
PI Film | |||||||
Adhesive | |||||||
Release Paper | |||||||
Peel Strength |
Kgf/cm (90˚) |
normal |
H mil≧0.8 1 mil≧1.0 |
1.0~1.3 | 1.2~1.4 | IPC-TM-650 2.4.9 | |
Dimension Stability | TD | % | Method B | ≦±0.15 | 0.05~0.10 | 0.04~0.09 | IPC-TM-650 2.2.4 |
MD | % | -0.07~0.04 | -0.05~-0.08 | ||||
Resin Flow | mm | A | 0.05~0.15 | 0.09~0.12 | 0.10~0.15 | IPC-TM-650 2.3.17.1 | |
Solder Float Resistance | --- | 300℃/10sec | No Change Appearance | Pass | Pass | IPC-TM-650 2.4.13 | |
Moisture Absorption | % | D-24/23 | ≦2.0 | 1.0~1.2 | 1.0~1.3 | IPC-TM-650 2.6.2 | |
Volume Resistance | Ω-cm | C-96/23/65 | ≧1012 | ≧1014 | ≧1014 | IPC-TM-650 2.5.17 | |
Surface Resistance | Ω | C-96/23/65 | ≧1010 | ≧1012 | ≧1012 | ||
Insulation resistance | Ω | C-96/23/65 | ≧109 | ≧109 | ≧109 | IPC-TM-650 2.6.3.2 | |
Dielectric constant 10MHZ | --- | C-48/40/90 | ≦4.0 | 3.4~3.6 | IPC-TM-650 2.5.5.3 | ||
Dissipation factor 10MHZ | --- | C-48/40/90 | ≦0.04 | 0.032~0.036 |