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无卤PI覆铜箔基材Halogen-Free Polyimide Film Based FCCL
产品特点：优异的耐高温高湿性能良好的尺寸安定性
产品特点：
优异的耐高温高湿性能
良好的尺寸安定性、挠曲性及耐离子迁移
优良的电性能，化学性能及耐热性能
不含卤素, 阻燃性能达到UL94 VTM-0
本产品符合IPC规范
Feature：
Excellent high humidity and temperature resistance
Excellent dimensional stability，High flexibility and
Excellent Migration ability
Excellent electrical ,chemical and thermal property
Halogen free and Flame retardancy UL 94VTM-0
Meet with IPC standards
产品特性(FCCL Characteristic)：
| 特性 property | 单位 Unit | 条件 Condition | 标准 Standard | AFES131218 | AFES131212 | AFES252018 | 测试方法 Test method | |
| PI Film | ||||||||
| Adhesive | ||||||||
| Copper Foil | ||||||||
| Peel Strength |
Kgf/cm (90˚) | normal |
H mil≧0.8 1 mil≧1.0 | 1.3~1.5 | 1.1~1.3 | 1.3~1.7 | IPC-TM-650 2.4.9 | |
| Dimension Stability | TD | % | Method B | ≦±0.15 | 0.05~0.10 | 0.04~0.09 | 0.06~0.10 | IPC-TM-650 2.2.4 |
| MD | % | -0.07~0.04 | -0.05~-0.08 | -0.06~0.05 | ||||
| Solder Float Resistance | --- | 300℃/10sec | No Change Appearance | Pass | Pass | Pass | IPC-TM-650 2.4.13 | |
| Chemical Resistance | % | NaOH | ≦20 | 1~7 | 1~7 | 1~7 | IPC-TM-650 2.3.2 | |
| % | HCI | 1~8 | 1~8 | 1~8 | ||||
| % | IPA | 1~7 | 1~7 | 1~7 | ||||
| Moisture Absorption | % | D-24/23 | ≦2.0 | 0.9~1.2 | 1.0~1.3 | 1.0~1.3 | IPC-TM-650 2.6.2 | |
| Volume Resistance | Ω-cm | C-96/23/65 | ≧1012 | ≧1014 | ≧1014 | ≧1014 | IPC-TM-650 2.5.17 | |
| Surface Resistance | Ω | C-96/23/65 | ≧1010 | ≧1012 | ≧1012 | ≧1012 | ||
| Insulation resistance | Ω | C-96/23/65 | ≧109 | ≧109 | ≧109 | ≧109 | IPC-TM-650 2.6.3.2 | |
| Dielectric constant 10MHZ | --- | C-48/40/90 | ≦4.0 | 3.4~3.6 | IPC-TM-650 2.5.5.3 | |||
| Dissipation factor 10MHZ | --- | C-48/40/90 | ≦0.04 | 0.032~0.036 | ||||
Note:1. Data shown above are nominal values for reference only，Details see Certification of Quality
2. Storage Condition：Vacuum Packaging: Below 30℃ for 1year，
Normal Packaging : Below 30℃,below 70% RH for 1year